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Precautions on the use of Multilayer chip inductors
Multilayer chip inductors for high frequency, Multilayer chip bead inductors
Multilayer common mode choke coils（MC series F type）
■ PRECAUTIONS
1. Circuit Design
◆Verification of operating environment, electrical rating and performance
1. A malfunction in medical equipment, spacecraft, nuclear reactors, etc. may cause serious harm to human life or have severe social
ramifications.
Precautions
As such, any inductors to be used in such equipment may require higher safety and/or reliability considerations and should be clearly
differentiated from components used in general purpose applications.
◆Operating Current（Verification of Rated current）
1. The operating current for inductors must always be lower than their rated values.
2. Do not apply current in excess of the rated value because the inductance may be reduced due to the magnetic saturation effect.
2. PCB Design
◆Pattern configurations（Design of Land-patterns）
1. When inductors are mounted on a PCB, the size of land patterns and the amount of solder used（size of fillet）can directly affect inductor
performance.
Therefore, the following items must be carefully considered in the design of solder land patterns:
（1） The amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or
cracking. Therefore, when designing land-patterns it is necessary to consider the appropriate size and configuration of the solder
pads which in turn determines the amount of solder necessary to form the fillets.
Precautions
（2） When more than one part is jointly soldered onto the same land or pad, the pad must be designed so that each component's
soldering point is separated by solder-resist.
（3） The larger size of land patterns and amount of solder, the smaller Q value after mounting on PCB. It makes higher the Q value to
design land patterns smaller than terminal electrode of chips.
◆Pattern configurations（Inductor layout on panelized［ breakaway］ PC boards）
1. After inductors have been mounted on the boards, chips can be subjected to mechanical stresses in subsequent manufacturing
processes （PCB cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering the reflow soldered
boards etc.）For this reason, planning pattern configurations and the position of SMD inductors should be carefully performed to
minimize stress.
◆Pattern configurations（Design of Land-patterns）
1. The following diagrams and tables show some examples of recommended patterns to prevent excessive solder amounts（larger fillets
which extend above the component end terminations）. Examples of improper pattern designs are also shown.
（1） Recommended land dimensions for a typical chip inductor land patterns for PCBs
Land pattern
C
Chip inductor
Solder-resist
Chip inductor
W
B
A
B
L
Recommended land dimensions for wave-soldering
（Unit：mm）
Type
1608
2012
2125
2016
2520
3216
Technical
considerations
Size
L 1.6 2.0 2.0
W 0.8 1.25 1.25
A 0.8～1.0 1.0～1.4 1.0～1.4
B 0.5～0.8 0.8～1.5 0.8～1.5
C 0.6～0.8 0.9～1.2 0.9～1.2
2.0 2.5
1.6 2.0
1.0～1.4 1.0～1.4
0.8～1.5 0.6～1.0
1.3～1.6 1.6～2.0
3.2
1.6
1.8～2.5
0.8～1.7
1.2～1.6
Recommended land dimensions for reflow-soldering
（Unit：mm）
Type
0402
0603
1005
105
1608
2012
Size
L 0.4 0.6 1.0
W 0.2 0.3 0.5
A 0.15～0.25 0.20～0.30 0.45～0.55
B 0.10～0.20 0.20～0.30 0.40～0.50
C 0.15～0.30 0.25～0.40 0.45～0.55
1.0
0.6
0.50～0.55
0.30～0.40
0.60～0.70
1.6
0.8
0.8～1.0
0.6～0.8
0.6～0.8
2.0
1.25
0.8～1.2
0.8～1.2
0.9～1.6
Type
2125
2016
2520
3216
Size
A
B
C
L
W
2.0
1.25
0.8～1.2
0.8～1.2
0.9～1.6
2.0
1.6
0.8～1.2
0.8～1.2
1.2～2.0
2.5
2.0
1.0～1.4
0.6～1.0
1.8～2.2
3.2
1.6
1.8～2.5
0.6～1.5
1.2～2.0
? This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
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